Aluminum Stencil Frame
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Multilevel Stencil

Multilevel stencils also known as step stencils are the solution for the new electronic assemblies which include mixed technology applications like fine pitch technology with through-hole and SMT technologies. This mix requires different amounts of solder paste for different parts.

Provide optimum solder paste volume control

Eliminate co-planarity problems

Foils are permanently mounted into aluminum frames

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Overview

Doyan has the technical ability to manufacture step stencils (or multilevel stencils) by utilizing laser cutting and micro-milling technologies. Laser cutting ensures precise aperture and CNC milling ensures smooth and consistent thickness transitions. By using various foil thicknesses on the same stencil, this can control solder paste deposit in fine pitch areas while printing sufficient solder on large or through-hole pitch areas.

Advantage

yx.jpg Step stencils provide optimum solder paste volume control

Step stencil can eliminate two print processes in some cases

Step stencil can replace multiple stencils

Stencils with relief pocket-step in the area of protrusions will solve the problem of gasketing, paste smearing and risk of electrical short

Multiple steps can be achieved including step on squeegee side and relief on board side on the same stencil

Specs

Technology 100% laser cut
Material (foil) FG stainless steel
Stencil Thickness 0.002" to 0.016"
Minimum Cut Width 0.002"
Maximum Size 29"x29" inches
Aperture Tolerance within 0.00025"
Allow for Fiducial Data Yes
Allow for Panelized Data Yes

Available Frame

Frame Size Max. Foil Size Max. Image Size
8"x10"6"x8"4"x6"
10"x10"8"x8"6"x6"
12"x12"10"x10"8"x8"
12"x17"10"x15"8"x13"
15"x15"13"x13"11"x11"
23"x23"19"x19"17"x17"
29"x29"25"x22"23"x20"
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