3) Nano stencil is based on the electro-polished stencil with some nano rare metals added on its surface, and by changing the metal structure to make it well bonded, the hardness of the stencil is greatly improved and the rare metals have a repulsive effect on the flux in the solder paste, thus greatly reducing the number of screen washing and improving the production efficiency and printing quality. Nano stencil has all the advantages of the electropolished stencil, its non-stick paste advantages make its printing
more difficult to pull the tip, suitable for more precise components of the solder paste printing.
4) Electroforming stencil is the most complex type of stencil manufacturing technology, a metal forming process that forms a metal layer by depositing nickel metal onto a base plate or stencil. Electroforming stencil has smooth hole wall, inverted trapezoidal structure, best solder paste release, good printing performance for micro BGA, ultra-fine pitch QFP, and small chip components such as 0201, 01005. And because of the characteristics of the electroforming process itself, the edge of the hole to form a slightly higher than the thickness of the stencil ring protrusion, solder paste printing is quite a "sealing ring", in the printing of this sealing ring is conducive to stencil and pad or solder resist film close fit, to prevent the leakage of solder paste to the outside of the pad. Of course, the cost of this process stencil is also the highest.
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